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Qualcomm’s long-awaited second-gen 3D Sonic fingerprint sensor is 50% faster

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Qualcomm has announced a new, second-generation 3D Sonic fingerprint sensor, which it says is 77% larger and 50% faster. The sensor will debut in early 2021.

Read the full article: https://www.digitaltrends.com/mobile/qualcomm-3d-sonic-sensor-second-generation-ces-2021//

This article originally appeared on Digital Trends on 2021-01-11T20:00:25.000Z and was written by Christian de Looper.

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